Hysol PL 7000 Epoxy Film Adhesive

Manufacturer

Henkel-Hysol

Description

Hysol® PL 7000 is an epoxy film adhesive for composite bonding applications. Hysol® PL 7000 is formulated to provide excellent performance properties in composite bonding, and has excellent results on composite surfaces that have been exposed to bond shop environments and may have absorbed moisture.

Application

Ideal for composite co-curing and secondary bonding applications

Properties

Hysol® PL 7000 may be cured at 250 ºF (120 ºC) or 350 ºF (180 ºC) with service temperatures up to 300 F (150 ºC). Hysol® PL 7000 also exhibits excellent fracture toughness (G1C) over composite surfaces exhibiting cohesive failure patterns indicating superior adhesion characteristics. 

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Note: Technical information furnished is based on laboratory findings and is believed to be correct. No warranties of any kind are made except that the materials are of standard quality. All risk and liabilities arising from handling, storage and use of product, as well as compliance with applicable legal restrictions rest with the user. Nothing herein is to be taken as permission, inducement or recommendation to practice any patented invention or process without a license.