Hysol EA 9833.1 BMI Core Splice

Manufacturer

Henkel-Hysol

Description

Hysol EA 9833.1 is a modified bismaleimide foaming core splice adhesive.

Application

This product handles like an epoxy and may be cured @ 350°F/177°C followed by an elevated temperature post cure.

Properties

High service temperature

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Note: Technical information furnished is based on laboratory findings and is believed to be correct. No warranties of any kind are made except that the materials are of standard quality. All risk and liabilities arising from handling, storage and use of product, as well as compliance with applicable legal restrictions rest with the user. Nothing herein is to be taken as permission, inducement or recommendation to practice any patented invention or process without a license.