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Hysol PL 685 Core Splice

Manufacturer

Henkel-Hysol

Description

Plastilock® 685 (PL 685) is an expanding film adhesive

Application

Plastilock® 685 (PL 685) is designed for applications which require controlled expansion and environmental durability. PL 685 cures at either 250°F (121°C) or 350°F (177°C) and features a 30 day maximum out-time at 75°F (24°C).

Properties

Uniform controlled expansion, closed cell, moderate tack, sag resistant

Data Sheet

Material Safety Data Sheet (MSDS)

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Note: Technical information furnished is based on laboratory findings and is believed to be correct. No warranties of any kind are made except that the materials are of standard quality. All risk and liabilities arising from handling, storage and use of product, as well as compliance with applicable legal restrictions rest with the user. Nothing herein is to be taken as permission, inducement or recommendation to practice any patented invention or process without a license.