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Hysol PL 777-1FR Epoxy Film Adhesive

Manufacturer

Henkel-Hysol

Description

Hysol® PL 777-1FR is a flame retardant, non-metallic, modified epoxy film adhesive that is designed to cure at either 250°F (121°C) or 350°F (180°C) with a service temperature in excess of 300°F (149°C).

Application

Hysol PL 777-1FR is suitable for metal bond applications; however,it is suitable with many thermoplastic substrates.

Properties

Controlled flow and dual cure at 250°F (120°C) in 90 minutes or at 350°F (180°C) in 1 hour with service temperatures in excess of 270°F (132°C), excellent peel strength, superior hot/wet properties.

Data Sheet

Material Safety Data Sheet (MSDS)

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Note: Technical information furnished is based on laboratory findings and is believed to be correct. No warranties of any kind are made except that the materials are of standard quality. All risk and liabilities arising from handling, storage and use of product, as well as compliance with applicable legal restrictions rest with the user. Nothing herein is to be taken as permission, inducement or recommendation to practice any patented invention or process without a license.